Sale
Mr. JO Tecbond-SHV
₹1,575.00 – ₹14,963.00 Inclusive of all taxes
Two component 40 PHR thixotropic epoxy adhesive for high performance bonding.
- Description
- Properties
- Applications
- How To Use
- Technical Data Sheet(TDS)
- FAQs
Description
The product is a two component high viscosity, non-porous solvent free, room temperature curing popular epoxy adhesive suitable for bonds which can withstand elevated temperatures.
- Color: Grey
- Pot life @25°C: 20-40 mins
- Mixing Ratio: 100:40 PBW
- Mixture consistency: Thixotropic grey paste
- Optics: Opaque
- Temperature Resistance:up to 120°C
- Electrical Insulation
- Gap filling
- Adhesion that can withstand elevated temperature
- Water resistant bonding
Surface Preparation
- The mixture should be applied on a clean, rough and dry surface. This should be achieved by suitable mechanical and chemical means such as sandblasting Wire brushing or chemical etching. Suitable degreasing agent should be used to remove any grease, or oil traces on the surface.
- Use Part A & Part B in ratio 100:40 pbw. Mix the two components in small batches thoroughly for at least 2minutes. Apply the mix directly or using proper spatula to the pretreated surfaces.
- The joint components should be assembled as soon as the adhesive has been applied.
- Allow the material to cure for at least 24 hours before putting to use.
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