Sale
Mr. JO Tecbond-LV
₹866.00 – ₹10,938.00 Inclusive of all taxes
Two component 10 PHR low viscosity solvent free epoxy adhesive with creep resistant properties.
- Description
- Properties
- Applications
- How To Use
- Technical Data Sheet(TDS)
- FAQs
Description
The product is a two component solvent free multi purpose epoxy adhesive suitable for bonding material most commonly used in households as well as in engineering application.
- Color: Clear
- Pot life @25°C: 100-120 mins
- Mixing Ratio: 100:10 PBW
- Mixture consistency: Low Viscous liquid
- Dielectric strength: 15-20 kv/mm for 3mm thickness
- Thermal resistance: -25°C to 60°C
- Optics: Transparent
- Electrical bonding
- Metal to composite bonding
- Creep resist bonding
- High performance bonding
Surface Preparation
- The mixture should be applied on a clean, rough and dry surface.
- This should be achieved by suitable mechanical and chemical means such as sandblasting Wire brushing or chemical etching.
- Suitable degreasing agent should be used to remove any grease, or oil traces on the surface.
Application Method
- Use Jpoxy Part-A & Part-B in ratio 100:10 pbw. Mix the two components in small batches thoroughly for at least 2minutes. Apply the mix directly or using proper spatula to the pretreated surfaces.
- The joint components should be assembled as soon as the adhesive has been applied.
- Allow the material to cure for at least 24 hours before putting to use.
General Inquiries
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